JPS6258151B2 - - Google Patents
Info
- Publication number
- JPS6258151B2 JPS6258151B2 JP58071215A JP7121583A JPS6258151B2 JP S6258151 B2 JPS6258151 B2 JP S6258151B2 JP 58071215 A JP58071215 A JP 58071215A JP 7121583 A JP7121583 A JP 7121583A JP S6258151 B2 JPS6258151 B2 JP S6258151B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- semiconductor
- opening
- semiconductor layer
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electrodes Of Semiconductors (AREA)
- Bipolar Transistors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58071215A JPS5925247A (ja) | 1983-04-22 | 1983-04-22 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58071215A JPS5925247A (ja) | 1983-04-22 | 1983-04-22 | 半導体装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49114408A Division JPS5915495B2 (ja) | 1974-10-04 | 1974-10-04 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5925247A JPS5925247A (ja) | 1984-02-09 |
JPS6258151B2 true JPS6258151B2 (en]) | 1987-12-04 |
Family
ID=13454228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58071215A Granted JPS5925247A (ja) | 1983-04-22 | 1983-04-22 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5925247A (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5119484A (en) * | 1974-08-09 | 1976-02-16 | Hitachi Ltd | Handotaisochito sonoseizohoho |
-
1983
- 1983-04-22 JP JP58071215A patent/JPS5925247A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5925247A (ja) | 1984-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4074304A (en) | Semiconductor device having a miniature junction area and process for fabricating same | |
US4127931A (en) | Semiconductor device | |
US4041518A (en) | MIS semiconductor device and method of manufacturing the same | |
US4689872A (en) | Method of manufacturing a semiconductor device | |
JPS5915495B2 (ja) | 半導体装置 | |
JPS62156869A (ja) | バイポ−ラ・トランジスタ構造の製造方法 | |
US4261003A (en) | Integrated circuit structures with full dielectric isolation and a novel method for fabrication thereof | |
GB2180991A (en) | Silicide electrode for semiconductor device | |
US4216491A (en) | Semiconductor integrated circuit isolated through dielectric material | |
JPS62179764A (ja) | 壁スペ−サを有するバイポ−ラ半導体装置の製造方法 | |
JP3148766B2 (ja) | 半導体装置 | |
JPS6258152B2 (en]) | ||
JPS6258151B2 (en]) | ||
JPS6120141B2 (en]) | ||
CA1142270A (en) | Self-alignment method of depositing semiconductor metallization | |
JPS6013313B2 (ja) | 半導体装置の製造方法 | |
JPS61135136A (ja) | 半導体装置の製造方法 | |
JPH0366815B2 (en]) | ||
JPS6123665B2 (en]) | ||
JPH0590492A (ja) | 半導体集積回路とその製造方法 | |
JPH02135770A (ja) | 半導体集積回路 | |
JPS6113383B2 (en]) | ||
JPS5965465A (ja) | 半導体装置の製造方法 | |
JPS6022828B2 (ja) | 半導体装置の製造方法 | |
JPS6125217B2 (en]) |